SMD Grounding Contacts

Soft SMD Grounding Contacts

Laird’s SMD (Surface Mount Device) Grounding Contact is a foam cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder reflow compatible, and are suitable for automatic processing.

Sn / Cu Plated PI Film outer layer

Polymeric Foam Core

Soft SMD contacts are RoHS compliant

Halogen-free per IEC-61249-2-21 standard

Reflow tunnel compatible to 260° C

Patent Pending

UL94 HB Flammability Rating

Applications SMT (Surface Mount Technology), Pick-and-Place automatic process
Compression Set
<15
Hardness <20 (Shore A)
Industries Cabinet applications, Televisions, Consumer Electronics, Medical, Servers, Printers, Networking, Computing
Operating Temperature Range (°C) -40 to 70
Soldering Temperature Max 260
UL Flammability Rating UL 94 HB
Z-Axis Resistivity <0.06 (Before Reflow); <0.1 (After Reflow)

 

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Microwave Absorbers

Microwave Absorbers & Dielectrics Range from Techni3

Microwave Absorbers

Microwave Absorbers & Dielectrics Range from Techni3

NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Techni3’s invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.