Phase Change Materials

Phase Change Materials

Tpcm 900 Series

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50°C, Tpcm 900 begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the component’s surfaces, thereby reducing thermal resistance.

Tpcm 900 is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

Tpcm 900 shows no thermal performance degradation after 1,000 hours @130°C, or after 500 cycles, from -25°C to 125°C. The material softens and does not fully change state resulting in minimal migration (pump out) at operating temperatures (see viscosity curve).

Tpcm 900 is supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individually die cut parts can also be supplied.

• 0.03 ºC-in2/watt thermal resistance

• Naturally tacky at room temperature, no adhesive required

• No heatsink preheating required

• Available in 3 thicknesses, 0.005″, 0.010″ and 0.020″ (0.125mm, 0.25mm and 0.50mm)

Additional Product Description Standard Thicknesses:
0.005″ (0.13mm) 0.010″ (0.25mm) 0.020″ (0.51mm)
Consult the factory for alternate thicknesses

Standard Sheet Sizes:
9″ x 9″ (229mm x 229mm)
Tpcm™ 900 sheets are supplied with a white release paper and a bottom liner. Tpcm™ 900 is available in rolls with an extended tab liner or individual die cut shapes.

Pressure Sensitive Adhesive:
Pressure sensitive adhesive is not applicable for Tpcm™ products.

Reinforcement:
No reinforcement is necessary.

Applications • High frequency microprocessors
• Notebook and desktop PCs
• Computer servers
• DC/DC converts
• Memory modules
• Cache chips
• IGBTs
Burn In Temperature 70ºC for 5 minutes
Colour Yellow
Construction and Composition Non-reinforced boron nitride filled film
Dielectric Constant Range 1MHz 3.1, Test Method, ASTM D150
Operating Temperature – 25C to 125C
Operating Temperature Range (°C) – 25C to 125C
Other Tpcm 900 Series
Product Line Tpcm 900 Series
Product Testing Procedures
href=”http://www.lairdtech.com/pdfs/Compression2.pdf”>Compression/ Deflection href=”http://www.lairdtech.com/pdfs/Density.pdf.pdf”>Density href=”http://www.lairdtech.com/pdfs/Hardness.pdf.pdf”>Hardness href=”http://www.lairdtech.com/pdfs/Outgassing.pdf.pdf”>Outgassing href=”http://www.lairdtech.com/pdfs/ThermalResistance.pdf”>Thermal Resistance href=”http://www.lairdtech.com/pdfs/ThermalConductivity.pdf.pdf”>Thermal Conductivity href=”http://www.lairdtech.com/pdfs/DiecuttingQA.pdf.pdf”>Die Cutting Questions and Answers
Sheet Sizes (inches) 9 x 9
Sheet Sizes (mm) 229 x 229
Shelf Life 1 year
Temperature – Operating (Max Celsius) 125.00
Temperature – Operating (Min Celsius) -25.00
Test Method – Color Visual
Test Method – Thermal Conductivity ASTM D5470 (modified)
Thermal Conductivity (W/mK) 2.23
Thermal Resistance (°C-in²/W) 0.083-0.095 (50psi)
Thickness Max (mm) 0.50
Thickness Min (mm) 0.25
Thickness Tolerance (inches) ±0.001
Thickness Tolerance (mm) ±0.025
Volume Resistivity Volume Resistivity Del 2, Volume Resistivity, ASTM D257

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  • High quality products that are produced in the UK (not China).
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NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Techni3’s invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.