Thermal Gap Fillers


V0 Series

Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable.

Tflex 200V0’s silicone and ceramic technology allows a combination of great reliability, good thermal performance, and easy handling.

Soft and compressible for low stress applications

Naturally tacky needing no further adhesive coating

1.5 W/m-K thermal conductivity

Available in thicknesses from 0.010″ (0.25mm) to 0.200″ (5.0mm)

Additional Product Description STANDARD THICKNESSES
0.020 to 0.200-inch (0.5 to 5.0mm)
0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments
Inquire about availability of material and options above 0.200-inches

18” x 18” (457mm x 457mm) and 9” x 9” (229mm x 229mm) Tflex™ 200V0 may be die cut into
individual shapes. Pressure sensitive adhesive is not applicable for Tflex™ 200V0 products.

0.020” (0.51mm) and 0.030” (0.762mm) are fiberglass reinforced

Applications Cooling multiple components to the chassis or frame
Plasma supply panels
High speed mass storage drives
RDRAM memory modules
Heat pipe thermal solutions
Automotive engine control units
Wireless communication hardware
Breakdown Voltage (Volts AC) 1000, Test Method ASTM D149
Color Light Gray
Construction and Composition Alumina filled, silicone elastomer, fiberglass reinforced
Dielectric Constant Range 1MHz 1.8, Test Method, ASTM D150
Dissipation Factor at 1 MHz 0.00
Outgassing CVCM 0.50
Product Line V0 Series
Product Testing Procedures href=””>Compression/ Deflection href=””>Density href=””>Hardness href=””>Outgassing href=””>Thermal Resistance href=””>Thermal Conductivity href=””>Die Cutting Questions and Answers
Sheet Sizes (inches) 9 x 9|18 x 18
Sheet Sizes (mm) 229 x 229|457 x 457
Shelf Life Indefinite
Shore Hardness 45
Temperature Range -45 to 200C
Test Method – Dissipation Factor ASTM D150
Test Method – Thermal Conductivity ASTM D5470 (modified)
Thermal Conductivity (W/mK) 1.10
Thickness Max (mm) 5.00
Thickness Min (mm) 0.50
Thickness Tolerance (inches) ±0.002
Thickness Tolerance (mm) ±0.050
UL Flammability Rating 94 HB
Volume Resistivity Volume Resistivity Del 2, Volume Resistivity, ASTM D257


A service that is competitive, responsive and reliable

Our sales team and engineers are happy to work directly on site with clients always providing a personal and direct approach to fulfilling customer needs

  • High quality products that are produced in the UK (not China).
  • Local Sales team and engineers available 5 days per week.
  • Comprehensive back up and after sales service, with an actual technician ready to listen and help on the telephone 5 days a week. (No automated phone queuing system)
  • All products are REACH and ROHS compliant.
  • A Reliable, discreet and trustworthy partner with a proven track record in design and engineering.
  • Very competitive compared to overseas competition.
  • A huge reduction in air miles and lead times compared to overseas suppliers.
  • Able to deliver to most destinations in the European Union within 24hrs.

Microwave Absorbers

Microwave Absorbers & Dielectrics Range from Techni3

Microwave Absorbers

Microwave Absorbers & Dielectrics Range from Techni3

NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Techni3’s invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.