TFlex 300

Thermal Gap Fillers

TFLEX Series

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high
rate of compliancy allows the material to “totally blanket” the component, enhancing
thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.

Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.
With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low
pressures.

Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of
parts that must slide together, such as a card into a chassis.

Extreme compliancy allows material to “totally blanket” component(s)

Thermal conductivity of 1.2 W/mK

Available in thicknesses from 0.020” – 0.200” (.5mm – 5.0mm)

Low compression set enables the pad to be reused many times

Applications Notebook computers
Handheld microprocessor devices
Telecommunication hardware
Semiconductor test equipment
Servers and desktop computers
Memory modules
Mass storage devices
Power conversion equipment
Flat panel displays
Audio & video components
GPS navigation equipment
Automotive engine control
LED lighting
Household appliances
Lighting ballasts
Colour Light Green
Density 1.75
Dielectric Constant Range 5.5
Elongation at break 50
Other

Construction & Composition

Ceramic filled silicone sheet

Thickness Range

0.020 (0.50mm)-0.200(5.08mm)

Thickness Tolerance

+/- 10%

Outgassing CVCM (Post Cured)

0.10%

Thermal Resistance @ 40 mils, 20 psi @ 1mm, 138KPa

1.15 °C-in2/W 7.42 °C-cm2/W

Percent Deflection @ 10 psi

21%

Percent Deflection @ 50 psi

48%

Percent Deflection @ 100 psi

61%

Thermal Expansion

754 ppm/°C

Breakdown Voltage

>250 VAC/mil

Outgassing Total Mass Loss 0.56
Product Line Tflex Series
Shore Hardness 27
Temperature Range (Max Celsius)  160.00
Temperature Range (Min Celsius) -40.00
Tensile Strength del 15
Thermal Conductivity (W/mK) 1.20
Thickness Max (mm) 5.00
Thickness Min (mm) 0.50
UL Flammability 94 V0
Volume Resistivity Volume Resistivity Del 6

 

A service that is competitive, responsive and reliable

Our sales team and engineers are happy to work directly on site with clients always providing a personal and direct approach to fulfilling customer needs

  • High quality products that are produced in the UK (not China).
  • Local Sales team and engineers available 5 days per week.
  • Comprehensive back up and after sales service, with an actual technician ready to listen and help on the telephone 5 days a week. (No automated phone queuing system)
  • All products are REACH and ROHS compliant.
  • A Reliable, discreet and trustworthy partner with a proven track record in design and engineering.
  • Very competitive compared to overseas competition.
  • A huge reduction in air miles and lead times compared to overseas suppliers.
  • Able to deliver to most destinations in the European Union within 24hrs.

Microwave Absorbers

Microwave Absorbers & Dielectrics Range from Techni3

Microwave Absorbers

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NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Techni3’s invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.