Thermally Conductive PCB

Thermally Conductive PCB

Tlam SS 1KA 04

Thermally Conductive Printed Circuit Board Substrate

Tlam SS 1KA is a thermally conductive printed circuit board (PCB) substrate. The substrate consists of a copper circuit layer bonded to an aluminum or copper base plate with Laird 3 watt/m-K 1KA dielectric. Tlam SS 1KA materials are processed through standard FR4 print and etch operations.

Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4, and this is the key to keeping components cool. The Tlam SS 1KA boards run through standard pick and place SMT and manual wire bond processes.

Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to thermal cycling. Customers have found that Tlam SS 1KA reduces the stress on solder bonds with ceramic devices.

Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch thick aluminum. Custom constructions of heavier weight circuit copper and thicker aluminum and copper base plates are also available.

? UL 746B Electrical/Mechanical RTI as high as 130?C

? RoHS compliant

? Environmentally green

? Lead-free solder compatible

? Compliant for low bond stress

Chemical Properties:

Water Absorption after 168hours – 0.5

Out-gassing total mass loss – 0.57

Collect Volatile Condensable Material – 0.06

 Additional Product Description  Typical value, for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. Peel strength is measured with 1oz Cu.
Applications • Network DC/DC power converters
• Battery powered equipment DC/DC power converters
• Ultra bright LED substrates
CTE in XY/Z axis , < Tg 32/43, > Tg Sep-19
Capacitance 1 kHz 5.9 1MHz 5.8, Test Method, ASTM D150
Comparative Tracking Index
600
Continuous AC 50
Continuous DC
95
Dielectric Constant Range
1 kHz 4.3
Dielectric Strength 650 (25.6)
Dielectric Thickness 0.004 (0.102)
Dissipation Factor at 1KHz 0.008
Elongation at break 0.8 @25C
1.0 @150C
Flexural Strength (MPa) 49.70
Glass Transition Temperature (°C)
105
Peak Recurring
140
Peel Strength 4.5 (0.8)
Poisson’s Ratio @ 25/150°C 1 5/8
Product Line Tlam SS 1KA Series
Solder Float (4 min. @ 288°C) Pass
Soldering Temperature Maximum 288
Surface Resistivity
1.00E+10
Temperature – Operating (Max Celsius) 110.00
Tensile Strength del 52.2
Thermal Conductivity (W/mK) 3.00
Thermal Resistance (°C-in²/W) 0.05 (0.34)
UL Continuous Operating Temperature (°C) 110
UL Flammability 94V0
Volume Resistivity Volume Resistivity Del 1.2
Youngs Modulus at 25/150C 3 16/27

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Our sales team and engineers are happy to work directly on site with clients always providing a personal and direct approach to fulfilling customer needs

  • High quality products that are produced in the UK (not China).
  • Local Sales team and engineers available 5 days per week.
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  • All products are REACH and ROHS compliant.
  • A Reliable, discreet and trustworthy partner with a proven track record in design and engineering.
  • Very competitive compared to overseas competition.
  • A huge reduction in air miles and lead times compared to overseas suppliers.
  • Able to deliver to most destinations in the European Union within 24hrs.

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Microwave Absorbers & Dielectrics Range from Techni3

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NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated Techni3’s invoice, quotation, or order acknowledgement. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.